Capabilities
The LCDRF maintains capabilities for complete prototyping of
passive-driven liquid crystal devices, and fabrication of active matrix
devices using TFT substrates supplied by others. Substrate sizes up to
Gen 1 (320 x 400 mm) or 14"x14" can be processed.

Facility Capabilities include:

• Glass cleaning: ultrasonic, UV/ozone, plasma
• Photolithography / patterning: pattern generation in positive resist (S1800 series) to 3 microns or less; etching processes for ITO, chrome, aluminum, SiO2, nickel, gold, and others; laser repair
• Wet coatings: spincoating, roller coating (not standard)
• Vacuum deposition: RF and DC sputter coating of SiO2, nickel, and other
  films; e-beam evaporation; ion-assisted e-beam evaporation; thermal evaporation
• Alignment layers: various polyimide materials; SiOx oblique evaporation
• Cell assembly: XY dispenser for gasket seal; wet or dry spacer application; post spacers
• Glass scribing: manual and programmable glass scribers, for single or laminated substrates, with camera alignment
• Cell filling: vacuum filling, end sealing
• Characterization: Spectroscopic ellipsometry for thin film characterization; SEM; profilometry
• Environmental testing: temp and humidity chamber, programmable

Processes
Raw Glass to Patterned Glass
Glass cutting
Ultrasonic Bath
Glass Cleaning
Storage
UV/Ozone
Spin Programming
Photoresist Spin
Flash Resist
Mask Cleaning
UV Expose NuArc
UV Expose Oriel
Develop
Etch Test
Etch
Strip KOH
Strip Acetone
Vac Oven
Laser Repair (ITO/glass)

Single Substrate Processing
Barrier Spin
Flash Barrier
Over Programming
Bake Barrier
Polyimide Spin
Polyimide Flash
Bake Polyimide
Rubbing Hand
Rubbing Machine

Cell Assembly
Gasket Programming
Gasket Dispense
Spacer Dispense
Spacer Evaluate
Cell Assembly

Post Assembly Procedures
Cell Gap Measure
Array Scribe
Backseal
LC Degas
LC Filing
Cell press
Port Seal
EO Measure
Lead Attach